Services
Comprehensive ATP Services Designed for Speed, Scalability, and Quality
At ATPION, we offer a full spectrum of Assembly, Testing, and Packaging (ATP) services tailored to meet the demands of modern semiconductor applications. From wafer probe testing to System-in-Package (SiP) solutions, our capabilities are engineered to ensure efficiency, accuracy, and international compliance at every stage. Whether you’re developing next-gen AI chips or advanced automotive components, we’re equipped to support your success—right here in Mexico.
Services
Comprehensive ATP Services Designed for Speed, Scalability, and Quality
At ATPION, we offer a full spectrum of Assembly, Testing, and Packaging (ATP) services tailored to meet the demands of modern semiconductor applications. From wafer probe testing to System-in-Package (SiP) solutions, our capabilities are engineered to ensure efficiency, accuracy, and international compliance at every stage. Whether you’re developing next-gen AI chips or advanced automotive components, we’re equipped to support your success—right here in Mexico.
PRODUCT & SERVICES
We offer a full suite of services aimed to meet the stringest quality control standards for our customers.
WAFER PROCESSING
• Wafer bumping techniques to
prepare for packaging process.
• Wafer probing capabilities to test
individual dies for functionality.
• Wafer backgrinding to achieve
desired thickness for packaging.
DIVERSE PACKAGING SOLUTIONS
• Develop a range of leadframe and
substrate based IC packaging to
accommodate various semiconductor
applications.
• Advanced packagin like SIP and WLCSP.
COMPREHENSIVE TESTING SERVICES
• High frequency RF testing and mixed
signal test capabilities to ensure product
performance.
• Setup dedicated test engineering support
and failure analysis team to enhance
quality assurance.
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